Over the past fifteen years ago to open the door cassette system (FOUP (Front Opening Unified Pod) / LPU (Load-port Unit)) has been adopted by a majority twelve inches semiconductor plant and has been proven to provide a free ( or very little) particle contamination of the environment, only its failure to provide free (or very little)
Manufacturing environment for water, oxygen or gaseous molecules. However, after the wafer transfer box door is opened, the wafer is also very contaminated during the process of being transferred into the process chamber in the micro environment.
How to effectively prevent the microenvironmental water vapor from entering the FOUP is a problem that needs to be solved and controlled immediately. There are still few published literatures about filling with nitrogen gas or clean dry air after the wafer transfer box door is opened. It is technically challenging, but it is urgently needed for advanced manufacturing processes. In order to overcome the above challenges, this paper proposes a new solution, the door When turned on, the device that produces a uniform air curtain at the junction of the loadport and the FOUP produces a downward blowing curtain to prevent the EFEM (Equipment Front End Module) airflow from invading the FOUP.
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